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| Main Authors: | , , , , |
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| Format: | Preprint |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2411.12690 |
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| _version_ | 1866912126751211520 |
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| author | Zhu, Tianxiang Wang, Qipan Lin, Yibo Wang, Runsheng Huang, Ru |
| author_facet | Zhu, Tianxiang Wang, Qipan Lin, Yibo Wang, Runsheng Huang, Ru |
| contents | Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate simulation results, it is very time- and memory-consuming for large-scale analysis. Over the past decade, the linear superposition method has been utilized to perform fast thermal stress estimations of TSV arrays, but it suffers from a lack of accuracy. In this paper, we propose MORE-Stress, a novel strict numerical algorithm for efficient thermal stress simulation of TSV arrays based on model order reduction. Extensive experimental results demonstrate that our algorithm can realize a 153-504 times reduction in computational time and a 39-115 times reduction in memory usage compared with the commercial software ANSYS, with negligible errors less than 1%. Our algorithm is as efficient as the linear superposition method, with an order of magnitude smaller errors and fast convergence. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2411_12690 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC Zhu, Tianxiang Wang, Qipan Lin, Yibo Wang, Runsheng Huang, Ru Computational Engineering, Finance, and Science Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate simulation results, it is very time- and memory-consuming for large-scale analysis. Over the past decade, the linear superposition method has been utilized to perform fast thermal stress estimations of TSV arrays, but it suffers from a lack of accuracy. In this paper, we propose MORE-Stress, a novel strict numerical algorithm for efficient thermal stress simulation of TSV arrays based on model order reduction. Extensive experimental results demonstrate that our algorithm can realize a 153-504 times reduction in computational time and a 39-115 times reduction in memory usage compared with the commercial software ANSYS, with negligible errors less than 1%. Our algorithm is as efficient as the linear superposition method, with an order of magnitude smaller errors and fast convergence. |
| title | MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC |
| topic | Computational Engineering, Finance, and Science |
| url | https://arxiv.org/abs/2411.12690 |