APA-Zitierstil (7. Ausg.)

Lee, Y., Bandari, V. K., McCaskill, J. S., Adluri, P., Karnaushenko, D., Karnaushenko, D. D., & Schmidt, O. G. (2024). 3D Modular Microrobots: Micro-Origami Cubes with Integrated Si Chips Dive, Communicate, Flash Programs, and Form Collectives.

Chicago-Zitierstil (17. Ausg.)

Lee, Yeji, Vineeth K. Bandari, John S. McCaskill, Pranathi Adluri, Daniil Karnaushenko, Dmitriy D. Karnaushenko, und Oliver G. Schmidt. 3D Modular Microrobots: Micro-Origami Cubes with Integrated Si Chips Dive, Communicate, Flash Programs, and Form Collectives. 2024.

MLA-Zitierstil (9. Ausg.)

Lee, Yeji, et al. 3D Modular Microrobots: Micro-Origami Cubes with Integrated Si Chips Dive, Communicate, Flash Programs, and Form Collectives. 2024.