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| Main Authors: | , , , , , , , , , , , , , , , , , |
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| Format: | Preprint |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2412.06570 |
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| _version_ | 1866929620686733312 |
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| author | Knickerbocker, John Heroux, Jean Benoit Bonilla, Griselda Hsu, Hsiang Liu, Neng Ramos, Adrian Paz Arguin, Francois Tribodeau, Yan Terjani, Badr Schultz, Mark Ganti, Raghu Kiran Chu, Linsong Marushima, Chinami Taira, Yoichi Kohara, Sayuri Horibe, Akihiro Mori, Hiroyuki Numata, Hidetoshi |
| author_facet | Knickerbocker, John Heroux, Jean Benoit Bonilla, Griselda Hsu, Hsiang Liu, Neng Ramos, Adrian Paz Arguin, Francois Tribodeau, Yan Terjani, Badr Schultz, Mark Ganti, Raghu Kiran Chu, Linsong Marushima, Chinami Taira, Yoichi Kohara, Sayuri Horibe, Akihiro Mori, Hiroyuki Numata, Hidetoshi |
| contents | We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2412_06570 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications Knickerbocker, John Heroux, Jean Benoit Bonilla, Griselda Hsu, Hsiang Liu, Neng Ramos, Adrian Paz Arguin, Francois Tribodeau, Yan Terjani, Badr Schultz, Mark Ganti, Raghu Kiran Chu, Linsong Marushima, Chinami Taira, Yoichi Kohara, Sayuri Horibe, Akihiro Mori, Hiroyuki Numata, Hidetoshi Optics Materials Science We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm. |
| title | Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications |
| topic | Optics Materials Science |
| url | https://arxiv.org/abs/2412.06570 |