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Bibliographic Details
Main Authors:	Knickerbocker, John, Heroux, Jean Benoit, Bonilla, Griselda, Hsu, Hsiang, Liu, Neng, Ramos, Adrian Paz, Arguin, Francois, Tribodeau, Yan, Terjani, Badr, Schultz, Mark, Ganti, Raghu Kiran, Chu, Linsong, Marushima, Chinami, Taira, Yoichi, Kohara, Sayuri, Horibe, Akihiro, Mori, Hiroyuki, Numata, Hidetoshi
Format:	Preprint
Published:	2024
Subjects:	Optics Materials Science
Online Access:	https://arxiv.org/abs/2412.06570
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Table of Contents:

We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm.

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