Cita APA (7a ed.)

Iff, P., Bruggmann, B., Besta, M., Benini, L., & Hoefler, T. (2025). PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies.

Cita Chicago Style (17a ed.)

Iff, Patrick, Benigna Bruggmann, Maciej Besta, Luca Benini, y Torsten Hoefler. PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies. 2025.

Cita MLA (9a ed.)

Iff, Patrick, et al. PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies. 2025.