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PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies

Fuente: arXiv

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Bibliographic Details
Main Authors:	Iff, Patrick, Bruggmann, Benigna, Besta, Maciej, Benini, Luca, Hoefler, Torsten
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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