Ultralow-loss photonic integrated chips on 8-inch anomalous-dispersion Si$_3$N$_4$-SiO$_2$-Si Wafer

Fuente: arXiv
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Autores principales: Liu, Shuai, Puckett, Matthew W., Wu, Jianfeng, Hariri, Abdulkarim, Zhang, Yuheng, Zhang, Zheshen
Formato: Preprint
Publicado: 2025
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author Liu, Shuai
Puckett, Matthew W.
Wu, Jianfeng
Hariri, Abdulkarim
Zhang, Yuheng
Zhang, Zheshen
author_facet Liu, Shuai
Puckett, Matthew W.
Wu, Jianfeng
Hariri, Abdulkarim
Zhang, Yuheng
Zhang, Zheshen
contents We report the fabrication of 8-inch crack-free, dispersion-engineered Si$_3$N$_4$-SiO$_2$-Si wafers fully compatible with industrial foundry silicon photonics fabrication lines. By combining these wafers with a developed amorphous silicon (a-Si) hardmask etching technique, we achieve ultra-low-loss Si$_3$N$_4$ photonic integrated circuits (PICs) with intrinsic quality factors exceeding $25 \times 10^6$ using electron beam lithography and $24 \times 10^6$ using standard ultraviolet stepper photolithography. Frequency-comb generation is demonstrated on these high-quality Si$_3$N$_4$ PICs, corroborating the designed anomalous dispersion. These results establish the feasibility of mass-manufacturing high-performance, dispersion-engineered Si$_3$N$_4$ PICs using standard foundry-grade processes, opening new pathways for applications in optical communications, nonlinear optics, and quantum optics.
format Preprint
id arxiv_https___arxiv_org_abs_2502_05997
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Ultralow-loss photonic integrated chips on 8-inch anomalous-dispersion Si$_3$N$_4$-SiO$_2$-Si Wafer
Liu, Shuai
Puckett, Matthew W.
Wu, Jianfeng
Hariri, Abdulkarim
Zhang, Yuheng
Zhang, Zheshen
Optics
Applied Physics
We report the fabrication of 8-inch crack-free, dispersion-engineered Si$_3$N$_4$-SiO$_2$-Si wafers fully compatible with industrial foundry silicon photonics fabrication lines. By combining these wafers with a developed amorphous silicon (a-Si) hardmask etching technique, we achieve ultra-low-loss Si$_3$N$_4$ photonic integrated circuits (PICs) with intrinsic quality factors exceeding $25 \times 10^6$ using electron beam lithography and $24 \times 10^6$ using standard ultraviolet stepper photolithography. Frequency-comb generation is demonstrated on these high-quality Si$_3$N$_4$ PICs, corroborating the designed anomalous dispersion. These results establish the feasibility of mass-manufacturing high-performance, dispersion-engineered Si$_3$N$_4$ PICs using standard foundry-grade processes, opening new pathways for applications in optical communications, nonlinear optics, and quantum optics.
title Ultralow-loss photonic integrated chips on 8-inch anomalous-dispersion Si$_3$N$_4$-SiO$_2$-Si Wafer
topic Optics
Applied Physics
url https://arxiv.org/abs/2502.05997