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| Main Authors: | , , |
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| Format: | Preprint |
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2025
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| Online Access: | https://arxiv.org/abs/2502.16530 |
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| _version_ | 1866915167748489216 |
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| author | Rybachuk, Maksym Ali, Bakhtiar Litvinyuk, Igor V. |
| author_facet | Rybachuk, Maksym Ali, Bakhtiar Litvinyuk, Igor V. |
| contents | A 30-fs, 800 nm, 1 kHz femtosecond was used to photoablate diamond across radiant energy doses of 1 - 500 kJ/cm^2, with fluences of 10 - 50 J/cm^2 and, pulse counts from 100 to 10,000. The objective was to maximise material removal while minimising surface roughness (Ra) by operating above the photoablation threshold. Results demonstrate that 30-fs laser photoablation achieves Ra <0.1 \mum, meeting both high- and ultra-high-precision machining standards, while maintaining surface integrity and preventing heat-affected zone (HAZ) damage. At 1 kJ/cm^2 (10 J/cm^2 fluence, 100 pulses), an Ra of 0.09 \mum was achieved, satisfying ultra-high precision criteria (Ra <0.1 \mum). Additionally, doses below 10 kJ/cm^2 consistently met high-precision machining requirements (Ra <0.2 \mum). Photoablation efficiency peaked below 50 kJ/cm^2, after which material removal diminished, indicating non-linear process limitations. The sp3-diamond phase remained intact, as confirmed by the unchanged T2g Raman mode at 1332 cm^-1, with no detectable Raman G or D modes, confirming the absence of sp2-related graphitization, structural disorder, of nitrogen vacancy (NV) centre annealing. These findings establish 30 fs laser processing as a high-precision, damage-free approach for diamond machining, with promising applications in NV centre-containing quantum materials and advanced tooling. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2502_16530 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Ultrashort 30-fs laser photoablation for high-precision and damage-free diamond machining Rybachuk, Maksym Ali, Bakhtiar Litvinyuk, Igor V. Materials Science Optics A 30-fs, 800 nm, 1 kHz femtosecond was used to photoablate diamond across radiant energy doses of 1 - 500 kJ/cm^2, with fluences of 10 - 50 J/cm^2 and, pulse counts from 100 to 10,000. The objective was to maximise material removal while minimising surface roughness (Ra) by operating above the photoablation threshold. Results demonstrate that 30-fs laser photoablation achieves Ra <0.1 \mum, meeting both high- and ultra-high-precision machining standards, while maintaining surface integrity and preventing heat-affected zone (HAZ) damage. At 1 kJ/cm^2 (10 J/cm^2 fluence, 100 pulses), an Ra of 0.09 \mum was achieved, satisfying ultra-high precision criteria (Ra <0.1 \mum). Additionally, doses below 10 kJ/cm^2 consistently met high-precision machining requirements (Ra <0.2 \mum). Photoablation efficiency peaked below 50 kJ/cm^2, after which material removal diminished, indicating non-linear process limitations. The sp3-diamond phase remained intact, as confirmed by the unchanged T2g Raman mode at 1332 cm^-1, with no detectable Raman G or D modes, confirming the absence of sp2-related graphitization, structural disorder, of nitrogen vacancy (NV) centre annealing. These findings establish 30 fs laser processing as a high-precision, damage-free approach for diamond machining, with promising applications in NV centre-containing quantum materials and advanced tooling. |
| title | Ultrashort 30-fs laser photoablation for high-precision and damage-free diamond machining |
| topic | Materials Science Optics |
| url | https://arxiv.org/abs/2502.16530 |