Annealing behaviour of charge collection of neutron irradiated diodes from 8-inch p-type silicon wafers

Fuente: arXiv
Enregistré dans:
Détails bibliographiques
Auteurs principaux: Kałuzińska, Oliwia Agnieszka, Diehl, Leena, Sicking, Eva, Mühlnikel, Marie Christin, de Almeida, Pedro Gonçalo Dias, Kieseler, Jan, Kettner, Matthias, Walter, David, Defranchis, Matteo M.
Format: Preprint
Publié: 2025
Sujets:
Accès en ligne:
Tags: Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
_version_ 1866918077500751872
author Kałuzińska, Oliwia Agnieszka
Diehl, Leena
Sicking, Eva
Mühlnikel, Marie Christin
de Almeida, Pedro Gonçalo Dias
Kieseler, Jan
Kettner, Matthias
Walter, David
Defranchis, Matteo M.
author_facet Kałuzińska, Oliwia Agnieszka
Diehl, Leena
Sicking, Eva
Mühlnikel, Marie Christin
de Almeida, Pedro Gonçalo Dias
Kieseler, Jan
Kettner, Matthias
Walter, David
Defranchis, Matteo M.
contents To face the higher levels of radiation due to the 10-fold increase in integrated luminosity during the High-Luminosity LHC, the CMS detector will replace the current Calorimeter Endcap (CE) using the High-Granularity Calorimeter (HGCAL) concept. The electromagnetic section as well as the high-radiation regions of the hadronic section of the CE will be equipped with silicon pad sensors, covering a total area of 620 $\rm m^2$. Fluences up to $\rm1.0\cdot10^{16}~n_{eq}/cm^{2}$ and doses up to 2 MGy are expected considering an integrated luminosity of 3 $\rm ab^{-1}$. The whole CE will normally operate at -35°C in order to mitigate the effects of radiation damage. The silicon sensors are processed on novel 8-inch p-type wafers with an active thickness of 300 $μm$, 200 $μm$ and 120 $μm$ and cut into hexagonal shapes for optimal use of the wafer area and tiling. With each main sensor several small sized test structures (e.g pad diodes) are hosted on the wafers, used for quality assurance and radiation hardness tests. In order to investigate the radiation-induced bulk damage, these diodes have been irradiated with reactor neutrons at the TRIGA reactor in JSI (Jožef Stefan Institute, Ljubljana) to 13 fluences between $\rm6.5\cdot10^{14}~n_{eq}/cm^{2}$ and $\rm1.5\cdot10^{16}~n_{eq}/cm^{2}$. The charge collection of the irradiated silicon diodes was determined through transient current technique (TCT) measurements. The study focuses on the isothermal annealing behaviour of the bulk material at 60°C. The results have been used to extend the usage of thicker silicon sensors in regions expecting higher fluences and are being used to estimate the expected annealing effects of the silicon sensors during year-end technical stops and long HL-LHC shutdowns currently foreseen with a temperature around 0°C.
format Preprint
id arxiv_https___arxiv_org_abs_2503_01520
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Annealing behaviour of charge collection of neutron irradiated diodes from 8-inch p-type silicon wafers
Kałuzińska, Oliwia Agnieszka
Diehl, Leena
Sicking, Eva
Mühlnikel, Marie Christin
de Almeida, Pedro Gonçalo Dias
Kieseler, Jan
Kettner, Matthias
Walter, David
Defranchis, Matteo M.
Instrumentation and Detectors
High Energy Physics - Experiment
To face the higher levels of radiation due to the 10-fold increase in integrated luminosity during the High-Luminosity LHC, the CMS detector will replace the current Calorimeter Endcap (CE) using the High-Granularity Calorimeter (HGCAL) concept. The electromagnetic section as well as the high-radiation regions of the hadronic section of the CE will be equipped with silicon pad sensors, covering a total area of 620 $\rm m^2$. Fluences up to $\rm1.0\cdot10^{16}~n_{eq}/cm^{2}$ and doses up to 2 MGy are expected considering an integrated luminosity of 3 $\rm ab^{-1}$. The whole CE will normally operate at -35°C in order to mitigate the effects of radiation damage. The silicon sensors are processed on novel 8-inch p-type wafers with an active thickness of 300 $μm$, 200 $μm$ and 120 $μm$ and cut into hexagonal shapes for optimal use of the wafer area and tiling. With each main sensor several small sized test structures (e.g pad diodes) are hosted on the wafers, used for quality assurance and radiation hardness tests. In order to investigate the radiation-induced bulk damage, these diodes have been irradiated with reactor neutrons at the TRIGA reactor in JSI (Jožef Stefan Institute, Ljubljana) to 13 fluences between $\rm6.5\cdot10^{14}~n_{eq}/cm^{2}$ and $\rm1.5\cdot10^{16}~n_{eq}/cm^{2}$. The charge collection of the irradiated silicon diodes was determined through transient current technique (TCT) measurements. The study focuses on the isothermal annealing behaviour of the bulk material at 60°C. The results have been used to extend the usage of thicker silicon sensors in regions expecting higher fluences and are being used to estimate the expected annealing effects of the silicon sensors during year-end technical stops and long HL-LHC shutdowns currently foreseen with a temperature around 0°C.
title Annealing behaviour of charge collection of neutron irradiated diodes from 8-inch p-type silicon wafers
topic Instrumentation and Detectors
High Energy Physics - Experiment
url https://arxiv.org/abs/2503.01520