Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics

Fuente: arXiv
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Main Authors: Van Asch, Jef, Missinne, Jeroen, He, Junwen, Podpod, Arnita, Lepage, Guy, Golshani, Negin, Magdziak, Rafal, Sar, Huseyin, Kobbi, Hakim, Bipul, Swetanshu, Bode, Dieter, Ban, Yoojin, Ferraro, Filippo, Van Campenhout, Joris, Van Steenberge, Geert
Format: Preprint
Published: 2025
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author Van Asch, Jef
Missinne, Jeroen
He, Junwen
Podpod, Arnita
Lepage, Guy
Golshani, Negin
Magdziak, Rafal
Sar, Huseyin
Kobbi, Hakim
Bipul, Swetanshu
Bode, Dieter
Ban, Yoojin
Ferraro, Filippo
Van Campenhout, Joris
Van Steenberge, Geert
author_facet Van Asch, Jef
Missinne, Jeroen
He, Junwen
Podpod, Arnita
Lepage, Guy
Golshani, Negin
Magdziak, Rafal
Sar, Huseyin
Kobbi, Hakim
Bipul, Swetanshu
Bode, Dieter
Ban, Yoojin
Ferraro, Filippo
Van Campenhout, Joris
Van Steenberge, Geert
contents Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. We present two heterogeneous integration techniques that enable high-density electrical and optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides. In the first approach, polymer waveguides are patterned using standard lithography directly on the surface of the photonic chip, ensuring compatibility with chip embedding as commonly employed in chip-first fanout wafer-level packaging. In the second approach, photonic chips are flip-chip bonded to the package substrate. Both techniques have been experimentally validated, achieving a coupling efficiency near 1 dB between SiN and polymer waveguides in O-band, for both TE and TM polarizations. SiN tapers were designed using the "Mono" method to optimize phase-matching conditions between the two waveguides, a critical requirement for integrating diverse optical components. These results demonstrate the potential of polymer waveguides in Co-Packaged Optics applications, achieving sub-2 dB chip-to-chip and chip-to-fiber coupling losses.
format Preprint
id arxiv_https___arxiv_org_abs_2503_02712
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
Van Asch, Jef
Missinne, Jeroen
He, Junwen
Podpod, Arnita
Lepage, Guy
Golshani, Negin
Magdziak, Rafal
Sar, Huseyin
Kobbi, Hakim
Bipul, Swetanshu
Bode, Dieter
Ban, Yoojin
Ferraro, Filippo
Van Campenhout, Joris
Van Steenberge, Geert
Optics
Applied Physics
Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. We present two heterogeneous integration techniques that enable high-density electrical and optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides. In the first approach, polymer waveguides are patterned using standard lithography directly on the surface of the photonic chip, ensuring compatibility with chip embedding as commonly employed in chip-first fanout wafer-level packaging. In the second approach, photonic chips are flip-chip bonded to the package substrate. Both techniques have been experimentally validated, achieving a coupling efficiency near 1 dB between SiN and polymer waveguides in O-band, for both TE and TM polarizations. SiN tapers were designed using the "Mono" method to optimize phase-matching conditions between the two waveguides, a critical requirement for integrating diverse optical components. These results demonstrate the potential of polymer waveguides in Co-Packaged Optics applications, achieving sub-2 dB chip-to-chip and chip-to-fiber coupling losses.
title Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
topic Optics
Applied Physics
url https://arxiv.org/abs/2503.02712