Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs

Fuente: arXiv

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Bibliographic Details
Main Authors:	Wang, Runxi, Wang, Ziheng, Lin, Ting, Raby, Jacob M., Stan, Mircea R., Guo, Xinfei
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2503.07297