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Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Wang, Runxi, Wang, Ziheng, Lin, Ting, Raby, Jacob M., Stan, Mircea R., Guo, Xinfei
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Hardware Architecture
Accesso online:	Acceder al recurso
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