Parsons, R., Jang, K., Wang, Y., Novick, A., Smith, A. M., Tison, C. C., . . . Rizzo, A. (2025). Highly Uniform Thermally Undercut Silicon Photonic Devices in a 300 mm CMOS Foundry Process.
Cita Chicago Style (17a ed.)Parsons, Robert, et al. Highly Uniform Thermally Undercut Silicon Photonic Devices in a 300 Mm CMOS Foundry Process. 2025.
Cita MLA (9a ed.)Parsons, Robert, et al. Highly Uniform Thermally Undercut Silicon Photonic Devices in a 300 Mm CMOS Foundry Process. 2025.
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