Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation
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arXiv
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| Autori principali: | , , , , , , , , |
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| Natura: | Preprint |
| Pubblicazione: |
2025
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| author | Shi, Yunqi Gao, Chengrui Ren, Wanqi Xie, Peng Xu, Siyuan Xue, Ke Yuan, Mingxuan Qian, Chao Zhou, Zhi-Hua |
| author_facet | Shi, Yunqi Gao, Chengrui Ren, Wanqi Xie, Peng Xu, Siyuan Xue, Ke Yuan, Mingxuan Qian, Chao Zhou, Zhi-Hua |
| contents | This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2503_12946 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Shi, Yunqi Gao, Chengrui Ren, Wanqi Xie, Peng Xu, Siyuan Xue, Ke Yuan, Mingxuan Qian, Chao Zhou, Zhi-Hua Hardware Architecture Artificial Intelligence This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design. |
| title | Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation |
| topic | Hardware Architecture Artificial Intelligence |
| url | https://arxiv.org/abs/2503.12946 |