Scalable low loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips
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arXiv
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| Main Authors: | , , , , , , , , , , , , |
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| Format: | Preprint |
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2025
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| _version_ | 1866917960959918080 |
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| author | Bernson, Robert Witte, Alex Clark, Genevieve Gradkowski, Kamil Yang, Jeffrey Saha, Matt Zimmermann, Matthew Leenheer, Andrew Chen, Kevin Gilbert, Gerald Eichenfield, Matt Englund, Dirk O'Brien, Peter |
| author_facet | Bernson, Robert Witte, Alex Clark, Genevieve Gradkowski, Kamil Yang, Jeffrey Saha, Matt Zimmermann, Matthew Leenheer, Andrew Chen, Kevin Gilbert, Gerald Eichenfield, Matt Englund, Dirk O'Brien, Peter |
| contents | Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2503_14704 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Scalable low loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips Bernson, Robert Witte, Alex Clark, Genevieve Gradkowski, Kamil Yang, Jeffrey Saha, Matt Zimmermann, Matthew Leenheer, Andrew Chen, Kevin Gilbert, Gerald Eichenfield, Matt Englund, Dirk O'Brien, Peter Quantum Physics Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory. |
| title | Scalable low loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips |
| topic | Quantum Physics |
| url | https://arxiv.org/abs/2503.14704 |