Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging

Fuente: arXiv

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Bibliographic Details
Main Authors:	Bhoumik, Partho, Bailey, Christopher, Chakrabarty, Krishnendu
Format:	Preprint
Published:	2025
Subjects:	Systems and Control
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2503.14784