Saved in:
Bibliographic Details
Main Authors: Li, Shuai, Das, Sree Sourav, Wang, Haobo, Bati, Sujit, Balachandran, Prasanna V., Shiomi, Junichiro, Floro, Jerrold A., Zebarjadi, Mona
Format: Preprint
Published: 2025
Subjects:
Online Access:https://arxiv.org/abs/2503.21900
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1866908288219611136
author Li, Shuai
Das, Sree Sourav
Wang, Haobo
Bati, Sujit
Balachandran, Prasanna V.
Shiomi, Junichiro
Floro, Jerrold A.
Zebarjadi, Mona
author_facet Li, Shuai
Das, Sree Sourav
Wang, Haobo
Bati, Sujit
Balachandran, Prasanna V.
Shiomi, Junichiro
Floro, Jerrold A.
Zebarjadi, Mona
contents Metallic thermoelectric materials are promising candidates for active cooling applications, where high thermal conductivity and a high thermoelectric power factor are essential to maximize effective thermal conductivity. While metals inherently possess high thermal and electrical conductivities, they typically exhibit low Seebeck coefficients. In this work, we create a database and apply machine learning techniques to identify metallic binary alloys with large Seebeck coefficients. Specifically, we identify Ni-Fe as a promising candidate for active cooling. We then fabricate Ni-Fe ingots and demonstrate thermoelectric power factor values as high as 120 μW/{cm.K^2} at 200 K for these stable alloys, which are composed of cost-effective and abundant elements. Furthermore, we show that the effective thermal conductivity of these alloys, under small temperature differences, can exceed that of pure copper at temperatures above 250 K.
format Preprint
id arxiv_https___arxiv_org_abs_2503_21900
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle High thermoelectric power factor in Ni-Fe alloy for active cooling applications
Li, Shuai
Das, Sree Sourav
Wang, Haobo
Bati, Sujit
Balachandran, Prasanna V.
Shiomi, Junichiro
Floro, Jerrold A.
Zebarjadi, Mona
Materials Science
Metallic thermoelectric materials are promising candidates for active cooling applications, where high thermal conductivity and a high thermoelectric power factor are essential to maximize effective thermal conductivity. While metals inherently possess high thermal and electrical conductivities, they typically exhibit low Seebeck coefficients. In this work, we create a database and apply machine learning techniques to identify metallic binary alloys with large Seebeck coefficients. Specifically, we identify Ni-Fe as a promising candidate for active cooling. We then fabricate Ni-Fe ingots and demonstrate thermoelectric power factor values as high as 120 μW/{cm.K^2} at 200 K for these stable alloys, which are composed of cost-effective and abundant elements. Furthermore, we show that the effective thermal conductivity of these alloys, under small temperature differences, can exceed that of pure copper at temperatures above 250 K.
title High thermoelectric power factor in Ni-Fe alloy for active cooling applications
topic Materials Science
url https://arxiv.org/abs/2503.21900