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| Main Authors: | , |
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| Format: | Preprint |
| Published: |
2025
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2503.22603 |
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| _version_ | 1866918309402771456 |
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| author | Silva, Caio Romano, Giuseppe |
| author_facet | Silva, Caio Romano, Giuseppe |
| contents | The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in signal processing and machine learning. Here, we demonstrate MVM using inverse-designed metastructures that exploit heat conduction as the signal carrier. The proposed approach is based on a generalization of effective thermal conductivity to systems with multiple input and output ports: The input signal is encoded as a set of applied temperatures, while the output is represented by the power collected at designated terminals. The metastructures are obtained via density-based topology optimization, enabled by a differentiable thermal transport solver and automatic differentiation, achieving an accuracy $>99\%$ in most cases across a pool of matrices with dimensions $2\times2$ and $3\times3$. We apply this methodology -- termed thermal analog computing -- to realize matrices relevant to practical tasks, including the discrete Fourier transform and convolutional filters. These findings open new avenues for analog information processing in thermally active environments, including temperature-gradient sensing in microelectronics and thermal control systems. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2503_22603 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Thermal Analog Computing: Application to Matrix-vector Multiplication with Inverse-designed Metastructures Silva, Caio Romano, Giuseppe Mesoscale and Nanoscale Physics Materials Science The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in signal processing and machine learning. Here, we demonstrate MVM using inverse-designed metastructures that exploit heat conduction as the signal carrier. The proposed approach is based on a generalization of effective thermal conductivity to systems with multiple input and output ports: The input signal is encoded as a set of applied temperatures, while the output is represented by the power collected at designated terminals. The metastructures are obtained via density-based topology optimization, enabled by a differentiable thermal transport solver and automatic differentiation, achieving an accuracy $>99\%$ in most cases across a pool of matrices with dimensions $2\times2$ and $3\times3$. We apply this methodology -- termed thermal analog computing -- to realize matrices relevant to practical tasks, including the discrete Fourier transform and convolutional filters. These findings open new avenues for analog information processing in thermally active environments, including temperature-gradient sensing in microelectronics and thermal control systems. |
| title | Thermal Analog Computing: Application to Matrix-vector Multiplication with Inverse-designed Metastructures |
| topic | Mesoscale and Nanoscale Physics Materials Science |
| url | https://arxiv.org/abs/2503.22603 |