Saved in:
Bibliographic Details
Main Authors: Silva, Caio, Romano, Giuseppe
Format: Preprint
Published: 2025
Subjects:
Online Access:https://arxiv.org/abs/2503.22603
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1866918309402771456
author Silva, Caio
Romano, Giuseppe
author_facet Silva, Caio
Romano, Giuseppe
contents The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in signal processing and machine learning. Here, we demonstrate MVM using inverse-designed metastructures that exploit heat conduction as the signal carrier. The proposed approach is based on a generalization of effective thermal conductivity to systems with multiple input and output ports: The input signal is encoded as a set of applied temperatures, while the output is represented by the power collected at designated terminals. The metastructures are obtained via density-based topology optimization, enabled by a differentiable thermal transport solver and automatic differentiation, achieving an accuracy $>99\%$ in most cases across a pool of matrices with dimensions $2\times2$ and $3\times3$. We apply this methodology -- termed thermal analog computing -- to realize matrices relevant to practical tasks, including the discrete Fourier transform and convolutional filters. These findings open new avenues for analog information processing in thermally active environments, including temperature-gradient sensing in microelectronics and thermal control systems.
format Preprint
id arxiv_https___arxiv_org_abs_2503_22603
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Thermal Analog Computing: Application to Matrix-vector Multiplication with Inverse-designed Metastructures
Silva, Caio
Romano, Giuseppe
Mesoscale and Nanoscale Physics
Materials Science
The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in signal processing and machine learning. Here, we demonstrate MVM using inverse-designed metastructures that exploit heat conduction as the signal carrier. The proposed approach is based on a generalization of effective thermal conductivity to systems with multiple input and output ports: The input signal is encoded as a set of applied temperatures, while the output is represented by the power collected at designated terminals. The metastructures are obtained via density-based topology optimization, enabled by a differentiable thermal transport solver and automatic differentiation, achieving an accuracy $>99\%$ in most cases across a pool of matrices with dimensions $2\times2$ and $3\times3$. We apply this methodology -- termed thermal analog computing -- to realize matrices relevant to practical tasks, including the discrete Fourier transform and convolutional filters. These findings open new avenues for analog information processing in thermally active environments, including temperature-gradient sensing in microelectronics and thermal control systems.
title Thermal Analog Computing: Application to Matrix-vector Multiplication with Inverse-designed Metastructures
topic Mesoscale and Nanoscale Physics
Materials Science
url https://arxiv.org/abs/2503.22603