Resistive switching characteristics of Cu/MgO/MoS2/Cu structure

Fuente: arXiv
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Autori principali: Xiaolong, He, Peng, Chen
Natura: Preprint
Pubblicazione: 2025
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author Xiaolong, He
Peng, Chen
author_facet Xiaolong, He
Peng, Chen
contents During the study of resistive switching devices, researchers have found that the influence of the insertion layer cannot be ignored. Many reports have confirmed that the appropriate insertion layer can significantly improve the performance of the resistive switching devices. Therefore, in this work, we use magnetron sputtering to fabricate three devices: Cu/MgO/Cu, Cu/MgO/MoS2/Cu and Cu/MoS2/MgO/Cu. Through the characterization test of each device and the measurement of the I-V curve, it is found that the resistive switching characteristics of the Cu/MgO/Cu device will change greatly after adding an MoS2 insertion layer. The analysis results show that the inserted MoS2 layer does not change the main transmission mechanism (space charge limited conduction) of the device, but affects the regulating function of interfacial potential barrier, the effect also is related to the location of MoS2 inserted into the layer. Among the Cu/MgO/Cu, Cu/MgO/MoS2/Cu and Cu/MoS2/MgO/Cu devices, the Cu/MgO/MoS2/Cu device exhibits a larger switching ratio (about 103) and a lower reset voltage (about 0.21 V), which can be attributed to the regulation of the interface barrier between MgO and MoS2. In addition, when the MoS2 layer is inserted between the bottom electrodes Cu and MgO, the leakage current of the device is significantly reduced. Therefore, Cu/MoS2/MgO/Cu device has the highest commercial value from the point of view of practical applications. Finally, according to the XPS results and XRD results, we establish the conductive filament models for the three devices, and analyze the reasons for the different resistive switching characteristics of the three devices.
format Preprint
id arxiv_https___arxiv_org_abs_2504_02384
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Resistive switching characteristics of Cu/MgO/MoS2/Cu structure
Xiaolong, He
Peng, Chen
Applied Physics
Materials Science
During the study of resistive switching devices, researchers have found that the influence of the insertion layer cannot be ignored. Many reports have confirmed that the appropriate insertion layer can significantly improve the performance of the resistive switching devices. Therefore, in this work, we use magnetron sputtering to fabricate three devices: Cu/MgO/Cu, Cu/MgO/MoS2/Cu and Cu/MoS2/MgO/Cu. Through the characterization test of each device and the measurement of the I-V curve, it is found that the resistive switching characteristics of the Cu/MgO/Cu device will change greatly after adding an MoS2 insertion layer. The analysis results show that the inserted MoS2 layer does not change the main transmission mechanism (space charge limited conduction) of the device, but affects the regulating function of interfacial potential barrier, the effect also is related to the location of MoS2 inserted into the layer. Among the Cu/MgO/Cu, Cu/MgO/MoS2/Cu and Cu/MoS2/MgO/Cu devices, the Cu/MgO/MoS2/Cu device exhibits a larger switching ratio (about 103) and a lower reset voltage (about 0.21 V), which can be attributed to the regulation of the interface barrier between MgO and MoS2. In addition, when the MoS2 layer is inserted between the bottom electrodes Cu and MgO, the leakage current of the device is significantly reduced. Therefore, Cu/MoS2/MgO/Cu device has the highest commercial value from the point of view of practical applications. Finally, according to the XPS results and XRD results, we establish the conductive filament models for the three devices, and analyze the reasons for the different resistive switching characteristics of the three devices.
title Resistive switching characteristics of Cu/MgO/MoS2/Cu structure
topic Applied Physics
Materials Science
url https://arxiv.org/abs/2504.02384