Enregistré dans:
| Auteurs principaux: | , , , |
|---|---|
| Format: | Preprint |
| Publié: |
2025
|
| Sujets: | |
| Accès en ligne: | https://arxiv.org/abs/2504.19248 |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|
| _version_ | 1866918001582800896 |
|---|---|
| author | Yan, K. Wang, Zhaokun Mei, Haijuan Sun, Wanting |
| author_facet | Yan, K. Wang, Zhaokun Mei, Haijuan Sun, Wanting |
| contents | We report a novel experimental methodology for in situ measurement of electrical resistivity changes in T2 copper during dynamic compression utilizing a split Hopkinson pressure bar. The effects of adiabatic temperature rise and specimen shape deformation on the resistance were carefully accounted, which allowed one to isolate the contribution of microstructure changes such as dislocation evolution, defect generation, and lattice distortion. The latter allows for a real-time relationship between strain and electrical resistivity to be tracked. The experimental findings are also supplemented by molecular dynamics simulations that provide details about the process of microstructure evolution under dynamic loading. Up to now, very few in situ measurements has been carried out for changes in electrical resistivity during dynamic deformation, thus establishing a direct link for resistivity-strain which has important implications toward the understanding of plastic deformation and industrial application guidance. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2504_19248 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | In situ measurement of electrical resistivity evolution during dynamic compression of copper Yan, K. Wang, Zhaokun Mei, Haijuan Sun, Wanting Materials Science We report a novel experimental methodology for in situ measurement of electrical resistivity changes in T2 copper during dynamic compression utilizing a split Hopkinson pressure bar. The effects of adiabatic temperature rise and specimen shape deformation on the resistance were carefully accounted, which allowed one to isolate the contribution of microstructure changes such as dislocation evolution, defect generation, and lattice distortion. The latter allows for a real-time relationship between strain and electrical resistivity to be tracked. The experimental findings are also supplemented by molecular dynamics simulations that provide details about the process of microstructure evolution under dynamic loading. Up to now, very few in situ measurements has been carried out for changes in electrical resistivity during dynamic deformation, thus establishing a direct link for resistivity-strain which has important implications toward the understanding of plastic deformation and industrial application guidance. |
| title | In situ measurement of electrical resistivity evolution during dynamic compression of copper |
| topic | Materials Science |
| url | https://arxiv.org/abs/2504.19248 |