Cover Image

FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates

Fuente: arXiv

Saved in:

Bibliographic Details
Main Authors:	Iff, Patrick, Besta, Maciej, Hoefler, Torsten
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
Tags:	Add Tag No Tags, Be the first to tag this record!

Similar Items

PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
by: Iff, Patrick, et al.
Published: (2025)

RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
by: Iff, Patrick, et al.
Published: (2023)

Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
by: Iff, Patrick, et al.
Published: (2026)

Link Quality Aware Pathfinding for Chiplet Interconnects
by: Yen, Aaron, et al.
Published: (2026)

Chiplet-Gym: Optimizing Chiplet-based AI Accelerator Design with Reinforcement Learning
by: Mishty, Kaniz, et al.
Published: (2024)

Designing Reconfigurable Interconnection Network of Heterogeneous Chiplets Using Kalman Filter
by: Biglari, Siamak, et al.
Published: (2024)

Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles
by: Narashiman, Swathi, et al.
Published: (2024)

Chiplet Actuary: A Quantitative Cost Model and Multi-Chiplet Architecture Exploration
by: Feng, Yinxiao, et al.
Published: (2022)

ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
by: Bai, Kangbo, et al.
Published: (2026)

LEXI: Lossless Exponent Coding for Efficient Inter-Chiplet Communication in Hybrid LLMs
by: Sun, Miao, et al.
Published: (2026)

PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration
by: Chong, Yue Jiet, et al.
Published: (2025)

ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification
by: Monfared, Saleh Khalaj, et al.
Published: (2025)

The Survey of Chiplet-based Integrated Architecture: An EDA perspective
by: Chen, Shixin, et al.
Published: (2024)

Hecaton: Training Large Language Models with Scalable Chiplet Systems
by: Huang, Zongle, et al.
Published: (2024)

Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer
by: Sharma, Harsh, et al.
Published: (2025)

ChipletPart: Cost-Aware Partitioning for 2.5D Systems
by: Graening, Alexander, et al.
Published: (2025)

Monad: Towards Cost-effective Specialization for Chiplet-based Spatial Accelerators
by: Hao, Xiaochen, et al.
Published: (2023)

Designing Secure Interconnects for Modern Microelectronics: From SoCs to Emerging Chiplet-Based Architectures
by: Halder, Dipal
Published: (2023)

CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems
by: Pfromm, Lukas, et al.
Published: (2025)

ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI
by: Sudarshan, Chetan Choppali, et al.
Published: (2023)

Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond
by: Scheffler, Paul, et al.
Published: (2025)

Educating for Hardware Specialization in the Chiplet Era: A Path for the HPC Community
by: Yoshii, Kazutomo, et al.
Published: (2024)

Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
by: Liu, Zizhen, et al.
Published: (2026)

Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets
by: Yang, Zhuoping, et al.
Published: (2023)

Multi-Objective Hardware-Mapping Co-Optimisation for Multi-DNN Workloads on Chiplet-based Accelerators
by: Das, Abhijit, et al.
Published: (2022)

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
by: Haque, Emad, et al.
Published: (2025)

Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models
by: Peng, Huwan, et al.
Published: (2023)

CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems
by: Wu, Qihang, et al.
Published: (2026)

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis
by: Duan, Yuanyuan, et al.
Published: (2023)

Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads
by: Li, Boyu, et al.
Published: (2025)

Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim
by: Ali, Wajid, et al.
Published: (2025)

Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism
by: Wang, Cong, et al.
Published: (2025)

Cambricon-LLM: A Chiplet-Based Hybrid Architecture for On-Device Inference of 70B LLM
by: Yu, Zhongkai, et al.
Published: (2024)

CHIME: Chiplet-based Heterogeneous Near-Memory Acceleration for Edge Multimodal LLM Inference
by: Chen, Yanru, et al.
Published: (2025)

THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures
by: Kanani, Alish, et al.
Published: (2025)

Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
by: Jin, Haoran, et al.
Published: (2025)

DS2SC-Agent: A Multi-Agent Automated Pipeline for Rapid Chiplet Model Generation
by: Wu, Yiwei, et al.
Published: (2026)

MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
by: Pfromm, Lukas, et al.
Published: (2024)

Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
by: Luo, Shuqing, et al.
Published: (2026)

Chiplet-Based RISC-V SoC with Modular AI Acceleration
by: Bharadwaj, Suhas Suresh, et al.
Published: (2025)