STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration

Fuente: arXiv

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Bibliographic Details
Main Authors:	Parekh, Varun Darshana, Hazenstab, Zachary Wyatt, Srinivasa, Srivatsa Rangachar, Chakrabarty, Krishnendu, Ni, Kai, Narayanan, Vijaykrishnan
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture Emerging Technologies
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2504.21140