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STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Parekh, Varun Darshana, Hazenstab, Zachary Wyatt, Srinivasa, Srivatsa Rangachar, Chakrabarty, Krishnendu, Ni, Kai, Narayanan, Vijaykrishnan
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Hardware Architecture Emerging Technologies
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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