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3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures

Fuente: arXiv

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Bibliographic Details
Main Authors:	Mayer, T., Bender, H., Lang, S. J. K., Luo, Z., Weber, J., Guizan, C. Moran, Dhieb, C., Zahn, D., Schwarzenbach, L., Hell, W., Andronic, M., Drost, A., Neumeier, K., Lerch, W., Nebrich, L., Hagelauer, A., Eisele, I., Pereira, R. N., Kutter, C.
Format:	Preprint
Published:	2025
Subjects:	Quantum Physics
Online Access:	Acceder al recurso
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