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Qualification of Bump Bonding in CMS Inner Tracker Pixel Modules for the Phase-2 Upgrade

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Detalles Bibliográficos
Autor principal:	Assiouras, Panagiotis
Formato:	Preprint
Publicado:	2025
Materias:	Instrumentation and Detectors High Energy Physics - Experiment
Acceso en línea:	Acceder al recurso
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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