Deployable 3D mesoscale structures through wafer fabrication, geometric frustration and bistable auxeticity

Fuente: arXiv

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Bibliographic Details
Main Authors:	Wang, Yue, Shum, Kelvin, Song, Yuyang, Chen, Tian
Format:	Preprint
Published:	2025
Subjects:	Applied Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2505.19329