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Deployable 3D mesoscale structures through wafer fabrication, geometric frustration and bistable auxeticity

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Wang, Yue, Shum, Kelvin, Song, Yuyang, Chen, Tian
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Applied Physics
Accesso online:	Acceder al recurso
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