Thickness-aware E(3)-Equivariant 3D Mesh Neural Networks

Fuente: arXiv
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Main Authors: Kim, Sungwon, Lee, Namkyeong, Doh, Yunyoung, Shin, Seungmin, Cho, Guimok, Jeon, Seung-Won, Kim, Sangkook, Park, Chanyoung
Format: Preprint
Published: 2025
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author Kim, Sungwon
Lee, Namkyeong
Doh, Yunyoung
Shin, Seungmin
Cho, Guimok
Jeon, Seung-Won
Kim, Sangkook
Park, Chanyoung
author_facet Kim, Sungwon
Lee, Namkyeong
Doh, Yunyoung
Shin, Seungmin
Cho, Guimok
Jeon, Seung-Won
Kim, Sangkook
Park, Chanyoung
contents Mesh-based 3D static analysis methods have recently emerged as efficient alternatives to traditional computational numerical solvers, significantly reducing computational costs and runtime for various physics-based analyses. However, these methods primarily focus on surface topology and geometry, often overlooking the inherent thickness of real-world 3D objects, which exhibits high correlations and similar behavior between opposing surfaces. This limitation arises from the disconnected nature of these surfaces and the absence of internal edge connections within the mesh. In this work, we propose a novel framework, the Thickness-aware E(3)-Equivariant 3D Mesh Neural Network (T-EMNN), that effectively integrates the thickness of 3D objects while maintaining the computational efficiency of surface meshes. Additionally, we introduce data-driven coordinates that encode spatial information while preserving E(3)-equivariance or invariance properties, ensuring consistent and robust analysis. Evaluations on a real-world industrial dataset demonstrate the superior performance of T-EMNN in accurately predicting node-level 3D deformations, effectively capturing thickness effects while maintaining computational efficiency.
format Preprint
id arxiv_https___arxiv_org_abs_2505_21572
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Thickness-aware E(3)-Equivariant 3D Mesh Neural Networks
Kim, Sungwon
Lee, Namkyeong
Doh, Yunyoung
Shin, Seungmin
Cho, Guimok
Jeon, Seung-Won
Kim, Sangkook
Park, Chanyoung
Computer Vision and Pattern Recognition
Artificial Intelligence
Machine Learning
Mesh-based 3D static analysis methods have recently emerged as efficient alternatives to traditional computational numerical solvers, significantly reducing computational costs and runtime for various physics-based analyses. However, these methods primarily focus on surface topology and geometry, often overlooking the inherent thickness of real-world 3D objects, which exhibits high correlations and similar behavior between opposing surfaces. This limitation arises from the disconnected nature of these surfaces and the absence of internal edge connections within the mesh. In this work, we propose a novel framework, the Thickness-aware E(3)-Equivariant 3D Mesh Neural Network (T-EMNN), that effectively integrates the thickness of 3D objects while maintaining the computational efficiency of surface meshes. Additionally, we introduce data-driven coordinates that encode spatial information while preserving E(3)-equivariance or invariance properties, ensuring consistent and robust analysis. Evaluations on a real-world industrial dataset demonstrate the superior performance of T-EMNN in accurately predicting node-level 3D deformations, effectively capturing thickness effects while maintaining computational efficiency.
title Thickness-aware E(3)-Equivariant 3D Mesh Neural Networks
topic Computer Vision and Pattern Recognition
Artificial Intelligence
Machine Learning
url https://arxiv.org/abs/2505.21572