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Autori principali: Wu, Yating, Sun, Haozhe, Xiong, Bo, Yv, Yalong, Zhang, Jiale, Zheng, Zhaojie, Ma, Wei, Chu, Tao
Natura: Preprint
Pubblicazione: 2025
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Accesso online:https://arxiv.org/abs/2506.18633
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author Wu, Yating
Sun, Haozhe
Xiong, Bo
Yv, Yalong
Zhang, Jiale
Zheng, Zhaojie
Ma, Wei
Chu, Tao
author_facet Wu, Yating
Sun, Haozhe
Xiong, Bo
Yv, Yalong
Zhang, Jiale
Zheng, Zhaojie
Ma, Wei
Chu, Tao
contents Limited by equipment precision, manufacturing deviations in waveguide width, etch depth, and layer thickness inevitably occur in photonic integrated circuits (PICs). These variations cause initial phase errors, compromising the reliability of phase-sensitive devices such as Mach-Zehnder Interferometers (MZI) and microring resonators. To overcome this, we report a nonvolatile, near-lossless post-trimming method utilizing sufficient high-temperature thermal treatment for undercut waveguides, reported here for the first time to the best of our knowledge. This CMOS-compatible approach requires no additional processes or equipment, enables simple electrical heating for trimming, and retains long-term stability after high-temperature removal, ensuring high energy efficiency. Transmission electron microscopy indicates that high-temperature thermal treatment induces irreversible lattice expansion in silicon waveguides, leading to a reduction in the real refractive index and enabling compensation for process errors. Experimental results using MZIs confirm a permanent refractive index reduction of 0.0173 and high-resolution tuning up to 5.25 bits, effective across a broadband spectrum and stable for over 218 days after final trimming. Furthermore, 15 MZIs on a single wafer are precisely calibrated to BAR, CROSS, or orthogonal states, demonstrating the method universality. This practical and scalable technique enables reliable post-fabrication trimming for next-generation low-cost, energy-efficient PIC applications such as optical switches and optical computing.
format Preprint
id arxiv_https___arxiv_org_abs_2506_18633
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Lossless, Non-Volatile Post-Fabrication Trimming of PICs via On-Chip High-Temperature Annealing of Undercut Waveguides
Wu, Yating
Sun, Haozhe
Xiong, Bo
Yv, Yalong
Zhang, Jiale
Zheng, Zhaojie
Ma, Wei
Chu, Tao
Optics
Applied Physics
Limited by equipment precision, manufacturing deviations in waveguide width, etch depth, and layer thickness inevitably occur in photonic integrated circuits (PICs). These variations cause initial phase errors, compromising the reliability of phase-sensitive devices such as Mach-Zehnder Interferometers (MZI) and microring resonators. To overcome this, we report a nonvolatile, near-lossless post-trimming method utilizing sufficient high-temperature thermal treatment for undercut waveguides, reported here for the first time to the best of our knowledge. This CMOS-compatible approach requires no additional processes or equipment, enables simple electrical heating for trimming, and retains long-term stability after high-temperature removal, ensuring high energy efficiency. Transmission electron microscopy indicates that high-temperature thermal treatment induces irreversible lattice expansion in silicon waveguides, leading to a reduction in the real refractive index and enabling compensation for process errors. Experimental results using MZIs confirm a permanent refractive index reduction of 0.0173 and high-resolution tuning up to 5.25 bits, effective across a broadband spectrum and stable for over 218 days after final trimming. Furthermore, 15 MZIs on a single wafer are precisely calibrated to BAR, CROSS, or orthogonal states, demonstrating the method universality. This practical and scalable technique enables reliable post-fabrication trimming for next-generation low-cost, energy-efficient PIC applications such as optical switches and optical computing.
title Lossless, Non-Volatile Post-Fabrication Trimming of PICs via On-Chip High-Temperature Annealing of Undercut Waveguides
topic Optics
Applied Physics
url https://arxiv.org/abs/2506.18633