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Main Authors: Jiang, Tong, Chen, Han, Yuan, Yubo, Xu, Xiang, Cao, Junwei, Wang, Hao, Sun, Xuechun, Li, Junshuai, Ma, Yaqing, Zhu, Huaze, Li, Wenbin, Kong, Wei
Format: Preprint
Published: 2025
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Online Access:https://arxiv.org/abs/2506.21038
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author Jiang, Tong
Chen, Han
Yuan, Yubo
Xu, Xiang
Cao, Junwei
Wang, Hao
Sun, Xuechun
Li, Junshuai
Ma, Yaqing
Zhu, Huaze
Li, Wenbin
Kong, Wei
author_facet Jiang, Tong
Chen, Han
Yuan, Yubo
Xu, Xiang
Cao, Junwei
Wang, Hao
Sun, Xuechun
Li, Junshuai
Ma, Yaqing
Zhu, Huaze
Li, Wenbin
Kong, Wei
contents Atomic-scale ferroelectric thin films hold great promise for high-density, low-power applications but face stability and voltage scaling challenges at extreme thinness. Here, we demonstrate ferroelectricity in single-crystalline two-dimensional (2D) Ga$_2$O$_3$, an ultra-wide-bandgap semiconductor, at just 6 angstrom thickness, exhibiting exceptional retention and thermal stability. We show that epitaxial beta-Ga$_2$O$_3$ can be exfoliated down to a half-unit cell thickness via a self-limiting mechanism, enabling a biaxial strain-induced phase transition into a novel ferroelectric layered structure. Strain modulation enables the reduction of polarization switching voltage to 0.8 V, meeting CMOS voltage scaling requirements. Theoretical calculations reveal that switching is driven by covalent bond reconstruction, effectively countering depolarization and enhancing stability. Additionally, we integrate ferroelectric 2D Ga$_2$O$_3$ onto silicon using a low-temperature, back-end-of-line-compatible process. This work advances the exploration of sub-nanometer ferroelectrics, paving the way for high-density, low-power, non-volatile applications seamlessly integrated with advanced silicon technology.
format Preprint
id arxiv_https___arxiv_org_abs_2506_21038
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Ferroelectricity in 6 Angstrom-Thick Two-dimensional Ga$_2$O$_3$
Jiang, Tong
Chen, Han
Yuan, Yubo
Xu, Xiang
Cao, Junwei
Wang, Hao
Sun, Xuechun
Li, Junshuai
Ma, Yaqing
Zhu, Huaze
Li, Wenbin
Kong, Wei
Materials Science
Atomic-scale ferroelectric thin films hold great promise for high-density, low-power applications but face stability and voltage scaling challenges at extreme thinness. Here, we demonstrate ferroelectricity in single-crystalline two-dimensional (2D) Ga$_2$O$_3$, an ultra-wide-bandgap semiconductor, at just 6 angstrom thickness, exhibiting exceptional retention and thermal stability. We show that epitaxial beta-Ga$_2$O$_3$ can be exfoliated down to a half-unit cell thickness via a self-limiting mechanism, enabling a biaxial strain-induced phase transition into a novel ferroelectric layered structure. Strain modulation enables the reduction of polarization switching voltage to 0.8 V, meeting CMOS voltage scaling requirements. Theoretical calculations reveal that switching is driven by covalent bond reconstruction, effectively countering depolarization and enhancing stability. Additionally, we integrate ferroelectric 2D Ga$_2$O$_3$ onto silicon using a low-temperature, back-end-of-line-compatible process. This work advances the exploration of sub-nanometer ferroelectrics, paving the way for high-density, low-power, non-volatile applications seamlessly integrated with advanced silicon technology.
title Ferroelectricity in 6 Angstrom-Thick Two-dimensional Ga$_2$O$_3$
topic Materials Science
url https://arxiv.org/abs/2506.21038