EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability

Fuente: arXiv

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Bibliographic Details
Main Authors:	Lamichhane, Subed, Lu, Haotian, Tan, Sheldon X. -D.
Format:	Preprint
Published:	2025
Subjects:	Systems and Control
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2507.00270