EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability
Fuente:
arXiv
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| Main Authors: | Lamichhane, Subed, Lu, Haotian, Tan, Sheldon X. -D. |
|---|---|
| Format: | Preprint |
| Published: |
2025
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| Subjects: | |
| Online Access: | |
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