Photonic Origami of Silica on a Silicon Chip with Microresonators and Concave Mirrors
Fuente:
arXiv
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| Autori principali: | , , , |
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| Natura: | Preprint |
| Pubblicazione: |
2025
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| _version_ | 1866912468617396224 |
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| author | Malhotra, Manya Ben-Daniel, Ronen Cheng, Fan Carmon, Tal |
| author_facet | Malhotra, Manya Ben-Daniel, Ronen Cheng, Fan Carmon, Tal |
| contents | 3D printing of high-quality silica photonic structures is particularly challenging, as surface roughness at the nanoscale can severely degrade optical performance through scattering losses. Here, we develop a technique to fold ultrasmooth silica on silicon chips into such desired 3D structures. A laser-induced, surface-tension-driven method achieves folding with 20 nm alignment accuracy, enabling origami-like polylines and helices with integrated 0.5 nm-smooth photonic devices. The technique allows for the fabrication of record length-to-thickness ratio structures, incorporating concave micromirrors with numerical aperture of 0.41, and microresonators with quality factors exceeding ${8 \times 10^6}$. This on-chip silica origami approach offers a pathway to transform planar electro-opto-mechanical circuits into high-quality 3D configurations. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2507_04484 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Photonic Origami of Silica on a Silicon Chip with Microresonators and Concave Mirrors Malhotra, Manya Ben-Daniel, Ronen Cheng, Fan Carmon, Tal Optics 3D printing of high-quality silica photonic structures is particularly challenging, as surface roughness at the nanoscale can severely degrade optical performance through scattering losses. Here, we develop a technique to fold ultrasmooth silica on silicon chips into such desired 3D structures. A laser-induced, surface-tension-driven method achieves folding with 20 nm alignment accuracy, enabling origami-like polylines and helices with integrated 0.5 nm-smooth photonic devices. The technique allows for the fabrication of record length-to-thickness ratio structures, incorporating concave micromirrors with numerical aperture of 0.41, and microresonators with quality factors exceeding ${8 \times 10^6}$. This on-chip silica origami approach offers a pathway to transform planar electro-opto-mechanical circuits into high-quality 3D configurations. |
| title | Photonic Origami of Silica on a Silicon Chip with Microresonators and Concave Mirrors |
| topic | Optics |
| url | https://arxiv.org/abs/2507.04484 |