On void formation during the simulated tensile testing of polymer-filler particle composites

Fuente: arXiv

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Bibliographic Details
Main Authors:	Karnes, John J., Mohottalalage, Supun S., Maiti, Amitesh, Saab, Andrew P., Weisgraber, Todd H.
Format:	Preprint
Published:	2025
Subjects:	Soft Condensed Matter Computational Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2507.05547