Less is more: removing a single bond increases the toughness of elastic networks
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arXiv
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| Main Authors: | , , , |
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| Format: | Preprint |
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2025
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| _version_ | 1866909694845517824 |
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| author | Sanner, Antoine Michel, Luca Lingua, Alessandra Kammer, David S. |
| author_facet | Sanner, Antoine Michel, Luca Lingua, Alessandra Kammer, David S. |
| contents | We investigate how the removal of a single bond affects the fracture behavior of triangular spring networks, whereby we systematically vary the position of the removed bond. Our simulations show that removing the bond has two contrasting effects on the fracture energy for initiation of crack propagation and on the fracture energy for failure of the entire network. A single missing bond can either lower or raise the initiation fracture energy, depending on its placement relative to the crack tip. In contrast, the failure fracture energy is always equal to or greater than that of a perfect network. For most initial placements of the missing bond, the crack path remains straight, and the increased failure fracture energy results from arrest at the point of maximum local fracture resistance. When the crack deviates from a straight path, we observe an even higher fracture energy, which we attribute primarily to crack bridging. This additional toughening mechanism becomes active only at low failure strains of the springs; at higher failure strains, the crack path tends to remain straight. Altogether, our results demonstrate that even a single bond removal can significantly enhance toughness, offering fundamental insights into the role of defects in polymer networks and informing the design of tough architected materials. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2507_13806 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Less is more: removing a single bond increases the toughness of elastic networks Sanner, Antoine Michel, Luca Lingua, Alessandra Kammer, David S. Soft Condensed Matter Materials Science We investigate how the removal of a single bond affects the fracture behavior of triangular spring networks, whereby we systematically vary the position of the removed bond. Our simulations show that removing the bond has two contrasting effects on the fracture energy for initiation of crack propagation and on the fracture energy for failure of the entire network. A single missing bond can either lower or raise the initiation fracture energy, depending on its placement relative to the crack tip. In contrast, the failure fracture energy is always equal to or greater than that of a perfect network. For most initial placements of the missing bond, the crack path remains straight, and the increased failure fracture energy results from arrest at the point of maximum local fracture resistance. When the crack deviates from a straight path, we observe an even higher fracture energy, which we attribute primarily to crack bridging. This additional toughening mechanism becomes active only at low failure strains of the springs; at higher failure strains, the crack path tends to remain straight. Altogether, our results demonstrate that even a single bond removal can significantly enhance toughness, offering fundamental insights into the role of defects in polymer networks and informing the design of tough architected materials. |
| title | Less is more: removing a single bond increases the toughness of elastic networks |
| topic | Soft Condensed Matter Materials Science |
| url | https://arxiv.org/abs/2507.13806 |