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Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer

Fuente: arXiv

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Bibliographic Details
Main Authors:	Sharma, Harsh, Doppa, Janardhan Rao, Ogras, Umit Y., Pande, Partha Pratim
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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