Copertina

ProForm: Solder-Free Circuit Assembly Using Thermoforming

Fuente: arXiv

Salvato in:

Dettagli Bibliografici
Autori principali:	Pourjafarian, Narjes, Yang, Zhenming, Lipton, Jeffrey I., Davaji, Benyamin, Abowd, Gregory D.
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Human-Computer Interaction Materials Science
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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