Enhancing interfacial thermal conductance in Si/Diamond heterostructures by phonon bridge

Fuente: arXiv

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Bibliographic Details
Main Authors:	Yin, Ershuai, Li, Qiang, Luo, Wenzhu, Wang, Lei
Format:	Preprint
Published:	2025
Subjects:	Materials Science Applied Physics J.2.7
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2507.22490