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Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology

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Bibliographic Details
Main Authors:	Chen, Yukai, Di Todaro, Massimiliano, Vermeersch, Bjorn, Oprins, Herman, Pagliari, Daniele Jahier, Ryckaert, Julien, Biswas, Dwaipayan, Myers, James
Format:	Preprint
Published:	2025
Subjects:	Emerging Technologies
Online Access:	Acceder al recurso
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