A scalable photonic quantum interconnect platform
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arXiv
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| Main Authors: | , , , , , , , , , , , , , , , , , , |
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| Format: | Preprint |
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2025
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| _version_ | 1866914053373296640 |
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| author | Riedel, Daniel Graziosi, Teodoro Wang, Zhuoxian De-Eknamkul, Chawina Abulnaga, Alex Dietz, Jonathan Mucchietto, Andrea Haas, Michael Sutula, Madison Barral, Pierre Pompili, Matteo Raha, Mouktik Robens, Carsten Ha, Jeonghoon Sukachev, Denis Levonian, David Bhaskar, Mihir Markham, Matthew Machielse, Bartholomeus |
| author_facet | Riedel, Daniel Graziosi, Teodoro Wang, Zhuoxian De-Eknamkul, Chawina Abulnaga, Alex Dietz, Jonathan Mucchietto, Andrea Haas, Michael Sutula, Madison Barral, Pierre Pompili, Matteo Raha, Mouktik Robens, Carsten Ha, Jeonghoon Sukachev, Denis Levonian, David Bhaskar, Mihir Markham, Matthew Machielse, Bartholomeus |
| contents | Many quantum networking applications require efficient photonic interfaces to quantum memories which can be produced at scale and with high yield. Synthetic diamond offers unique potential for the implementation of this technology as it hosts color centers which retain coherent optical interfaces and long spin coherence times in nanophotonic structures. Here, we report a technique enabling wafer-scale processing of thin-film diamond that combines ion implantation and membrane liftoff, high-quality overgrowth, targeted color center implantation, and serial, high-throughput thermocompression bonding with yields approaching unity. The deterministic deposition of thin diamond membranes onto semiconductor substrates facilitates consistent integration of photonic crystal cavities with silicon-vacancy (SiV) quantum memories. We demonstrate reliable, strong coupling of SiVs to photons with cooperativities approaching 100. Furthermore, we show that photonic crystal cavities can be reliably fabricated across several membranes bonded to the same handling chip. Our platform enables modular fabrication where the photonic layer can be integrated with functionalized substrates featuring electronic control lines such as coplanar waveguides for microwave delivery. Finally, we implement passive optical packaging with sub-decibel insertion loss. Together, these advances pave the way to the scalable assembly of optically addressable quantum memory arrays which are a key building block for modular photonic quantum interconnects. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2508_06675 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | A scalable photonic quantum interconnect platform Riedel, Daniel Graziosi, Teodoro Wang, Zhuoxian De-Eknamkul, Chawina Abulnaga, Alex Dietz, Jonathan Mucchietto, Andrea Haas, Michael Sutula, Madison Barral, Pierre Pompili, Matteo Raha, Mouktik Robens, Carsten Ha, Jeonghoon Sukachev, Denis Levonian, David Bhaskar, Mihir Markham, Matthew Machielse, Bartholomeus Quantum Physics Many quantum networking applications require efficient photonic interfaces to quantum memories which can be produced at scale and with high yield. Synthetic diamond offers unique potential for the implementation of this technology as it hosts color centers which retain coherent optical interfaces and long spin coherence times in nanophotonic structures. Here, we report a technique enabling wafer-scale processing of thin-film diamond that combines ion implantation and membrane liftoff, high-quality overgrowth, targeted color center implantation, and serial, high-throughput thermocompression bonding with yields approaching unity. The deterministic deposition of thin diamond membranes onto semiconductor substrates facilitates consistent integration of photonic crystal cavities with silicon-vacancy (SiV) quantum memories. We demonstrate reliable, strong coupling of SiVs to photons with cooperativities approaching 100. Furthermore, we show that photonic crystal cavities can be reliably fabricated across several membranes bonded to the same handling chip. Our platform enables modular fabrication where the photonic layer can be integrated with functionalized substrates featuring electronic control lines such as coplanar waveguides for microwave delivery. Finally, we implement passive optical packaging with sub-decibel insertion loss. Together, these advances pave the way to the scalable assembly of optically addressable quantum memory arrays which are a key building block for modular photonic quantum interconnects. |
| title | A scalable photonic quantum interconnect platform |
| topic | Quantum Physics |
| url | https://arxiv.org/abs/2508.06675 |