Tasa: Thermal-aware 3D-Stacked Architecture Design with Bandwidth Sharing for LLM Inference

Fuente: arXiv

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Bibliographic Details
Main Authors:	He, Siyuan, Yan, Peiran, He, Yandong, Zhuo, Youwei, Jia, Tianyu
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2508.07252