Virtual Sensing for Solder Layer Degradation and Temperature Monitoring in IGBT Modules

Fuente: arXiv

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Bibliographic Details
Main Authors:	Urgolo, Andrea, Stipsitz, Monika, Sanchis-Alepuz, Hèlios
Format:	Preprint
Published:	2025
Subjects:	Computational Physics Computational Engineering, Finance, and Science Machine Learning Systems and Control
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2508.10515