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Metallic Contact Contributions in Thermal Hall Conductivity Measurements

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Ma, Hongyu, Hu, Xuesong, Shi, Junren
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Materials Science
Accesso online:	Acceder al recurso
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