Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features

Fuente: arXiv

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Bibliographic Details
Main Authors:	Gong, Yanpeng, Li, Sishuai, Qin, Fei, Xu, Bingbing
Format:	Preprint
Published:	2025
Subjects:	Numerical Analysis
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2508.11410