Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration

Fuente: arXiv

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Bibliographic Details
Main Authors:	Liu, Yongxiang, Ma, Yuchun, Kurshan, Eren, Reinman, Glenn, Cong, Jason
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture Emerging Technologies
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2508.13158