Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits

Fuente: arXiv

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Bibliographic Details
Main Authors:	Chen, Yibo, Kurshan, Eren, Motschman, Dave, Johnson, Charles, Xie, Yuan
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture Emerging Technologies
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2508.13160