Precision optomechanical accelerometer via hybrid test mass integration
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arXiv
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| Format: | Preprint |
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2025
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| author | Bawden, Nathaniel Carey, Benjamin J. Yeo, Poh-Meng Arora, Nishta Sementilli, Leo Valenzuela, Victor M. Romero, Erick Harris, Glen I. Wegener, Margaret Bowen, Warwick P. |
| author_facet | Bawden, Nathaniel Carey, Benjamin J. Yeo, Poh-Meng Arora, Nishta Sementilli, Leo Valenzuela, Victor M. Romero, Erick Harris, Glen I. Wegener, Margaret Bowen, Warwick P. |
| contents | Accelerometers offer motion sensing capabilities across a wide range of areas, enabling navigational awareness in consumer goods and defense applications, and playing a key role in monitoring and control systems. To date, on-chip accelerometers have largely utilized a single device layer or substrate as a test mass. This constrains the test mass to the dimensions and density of the device layer or substrate, ultimately limiting the sensitivity of the device. We demonstrate a new approach which utilizes a pick-and-place bonding technique to increase the test mass of an on-chip accelerometer. By bonding a high-density platinum sphere to a nanomechanical silicon nitride trampoline membrane, we achieve a quality factor of 1900 in air with 95 mg test mass, corresponding to a thermomechanical noise limited acceleration sensitivity of $0.8\,\mathrm{n}g/\sqrt{\mathrm{Hz}}$. We optically probe the device's response to applied accelerations with increasing level of acoustic and vibration isolation, measuring a peak sensitivity of $5.5\,\mathrm{n}g/\sqrt{\mathrm{Hz}}$ at 117 Hz in air, limited by environmental vibrations. This represents the best peak sensitivity reported using a chip-integrated test mass. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2508_16088 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Precision optomechanical accelerometer via hybrid test mass integration Bawden, Nathaniel Carey, Benjamin J. Yeo, Poh-Meng Arora, Nishta Sementilli, Leo Valenzuela, Victor M. Romero, Erick Harris, Glen I. Wegener, Margaret Bowen, Warwick P. Applied Physics Accelerometers offer motion sensing capabilities across a wide range of areas, enabling navigational awareness in consumer goods and defense applications, and playing a key role in monitoring and control systems. To date, on-chip accelerometers have largely utilized a single device layer or substrate as a test mass. This constrains the test mass to the dimensions and density of the device layer or substrate, ultimately limiting the sensitivity of the device. We demonstrate a new approach which utilizes a pick-and-place bonding technique to increase the test mass of an on-chip accelerometer. By bonding a high-density platinum sphere to a nanomechanical silicon nitride trampoline membrane, we achieve a quality factor of 1900 in air with 95 mg test mass, corresponding to a thermomechanical noise limited acceleration sensitivity of $0.8\,\mathrm{n}g/\sqrt{\mathrm{Hz}}$. We optically probe the device's response to applied accelerations with increasing level of acoustic and vibration isolation, measuring a peak sensitivity of $5.5\,\mathrm{n}g/\sqrt{\mathrm{Hz}}$ at 117 Hz in air, limited by environmental vibrations. This represents the best peak sensitivity reported using a chip-integrated test mass. |
| title | Precision optomechanical accelerometer via hybrid test mass integration |
| topic | Applied Physics |
| url | https://arxiv.org/abs/2508.16088 |