Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
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arXiv
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| Main Authors: | , , , , , , |
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| Format: | Preprint |
| Published: |
2025
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| _version_ | 1866912555998380032 |
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| author | Gu, Peng Li, Shuangchen Stow, Dylan Barnes, Russell Liu, Liu Xie, Yuan Kursshan, Eren |
| author_facet | Gu, Peng Li, Shuangchen Stow, Dylan Barnes, Russell Liu, Liu Xie, Yuan Kursshan, Eren |
| contents | 3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware trojans, secure IC manufacturing and IP piracy. By utilizing intrinsic characteristics of 2.5D and 3D technologies, we propose novel opportunities in designing secure systems. We present: (i) a 3D architecture for shielding side-channel information; (ii) split fabrication using active interposers; (iii) circuit camouflage on monolithic 3D IC, and (iv) 3D IC-based security processing-in-memory (PIM). Advantages and challenges of these designs are discussed, showing that the new designs can improve existing countermeasures against security threats and further provide new security features. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2508_19309 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges Gu, Peng Li, Shuangchen Stow, Dylan Barnes, Russell Liu, Liu Xie, Yuan Kursshan, Eren Cryptography and Security Emerging Technologies 3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware trojans, secure IC manufacturing and IP piracy. By utilizing intrinsic characteristics of 2.5D and 3D technologies, we propose novel opportunities in designing secure systems. We present: (i) a 3D architecture for shielding side-channel information; (ii) split fabrication using active interposers; (iii) circuit camouflage on monolithic 3D IC, and (iv) 3D IC-based security processing-in-memory (PIM). Advantages and challenges of these designs are discussed, showing that the new designs can improve existing countermeasures against security threats and further provide new security features. |
| title | Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges |
| topic | Cryptography and Security Emerging Technologies |
| url | https://arxiv.org/abs/2508.19309 |