Toward Lifelong-Sustainable Electronic-Photonic AI Systems via Extreme Efficiency, Reconfigurability, and Robustness

Fuente: arXiv
Guardado en:
Detalles Bibliográficos
Autores principales: Yin, Ziang, Zhou, Hongjian, Sudarshan, Chetan Choppali, Chhabria, Vidya, Gu, Jiaqi
Formato: Preprint
Publicado: 2025
Materias:
Acceso en línea:
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
_version_ 1866916942278819840
author Yin, Ziang
Zhou, Hongjian
Sudarshan, Chetan Choppali
Chhabria, Vidya
Gu, Jiaqi
author_facet Yin, Ziang
Zhou, Hongjian
Sudarshan, Chetan Choppali
Chhabria, Vidya
Gu, Jiaqi
contents The relentless growth of large-scale artificial intelligence (AI) has created unprecedented demand for computational power, straining the energy, bandwidth, and scaling limits of conventional electronic platforms. Electronic-photonic integrated circuits (EPICs) have emerged as a compelling platform for next-generation AI systems, offering inherent advantages in ultra-high bandwidth, low latency, and energy efficiency for computing and interconnection. Beyond performance, EPICs also hold unique promises for sustainability. Fabricated in relaxed process nodes with fewer metal layers and lower defect densities, photonic devices naturally reduce embodied carbon footprint (CFP) compared to advanced digital electronic integrated circuits, while delivering orders-of-magnitude higher computing performance and interconnect bandwidth. To further advance the sustainability of photonic AI systems, we explore how electronic-photonic design automation (EPDA) and cross-layer co-design methodologies can amplify these inherent benefits. We present how advanced EPDA tools enable more compact layout generation, reducing both chip area and metal layer usage. We will also demonstrate how cross-layer device-circuit-architecture co-design unlocks new sustainability gains for photonic hardware: ultra-compact photonic circuit designs that minimize chip area cost, reconfigurable hardware topology that adapts to evolving AI workloads, and intelligent resilience mechanisms that prolong lifetime by tolerating variations and faults. By uniting intrinsic photonic efficiency with EPDA- and co-design-driven gains in area efficiency, reconfigurability, and robustness, we outline a vision for lifelong-sustainable electronic-photonic AI systems. This perspective highlights how EPIC AI systems can simultaneously meet the performance demands of modern AI and the urgent imperative for sustainable computing.
format Preprint
id arxiv_https___arxiv_org_abs_2509_07396
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Toward Lifelong-Sustainable Electronic-Photonic AI Systems via Extreme Efficiency, Reconfigurability, and Robustness
Yin, Ziang
Zhou, Hongjian
Sudarshan, Chetan Choppali
Chhabria, Vidya
Gu, Jiaqi
Optics
Artificial Intelligence
Emerging Technologies
The relentless growth of large-scale artificial intelligence (AI) has created unprecedented demand for computational power, straining the energy, bandwidth, and scaling limits of conventional electronic platforms. Electronic-photonic integrated circuits (EPICs) have emerged as a compelling platform for next-generation AI systems, offering inherent advantages in ultra-high bandwidth, low latency, and energy efficiency for computing and interconnection. Beyond performance, EPICs also hold unique promises for sustainability. Fabricated in relaxed process nodes with fewer metal layers and lower defect densities, photonic devices naturally reduce embodied carbon footprint (CFP) compared to advanced digital electronic integrated circuits, while delivering orders-of-magnitude higher computing performance and interconnect bandwidth. To further advance the sustainability of photonic AI systems, we explore how electronic-photonic design automation (EPDA) and cross-layer co-design methodologies can amplify these inherent benefits. We present how advanced EPDA tools enable more compact layout generation, reducing both chip area and metal layer usage. We will also demonstrate how cross-layer device-circuit-architecture co-design unlocks new sustainability gains for photonic hardware: ultra-compact photonic circuit designs that minimize chip area cost, reconfigurable hardware topology that adapts to evolving AI workloads, and intelligent resilience mechanisms that prolong lifetime by tolerating variations and faults. By uniting intrinsic photonic efficiency with EPDA- and co-design-driven gains in area efficiency, reconfigurability, and robustness, we outline a vision for lifelong-sustainable electronic-photonic AI systems. This perspective highlights how EPIC AI systems can simultaneously meet the performance demands of modern AI and the urgent imperative for sustainable computing.
title Toward Lifelong-Sustainable Electronic-Photonic AI Systems via Extreme Efficiency, Reconfigurability, and Robustness
topic Optics
Artificial Intelligence
Emerging Technologies
url https://arxiv.org/abs/2509.07396