DarwinWafer: A Wafer-Scale Neuromorphic Chip

Fuente: arXiv
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Main Authors: Zhu, Xiaolei, Jin, Xiaofei, Kang, Ziyang, Sun, Chonghui, Feng, Junjie, Hu, Dingwen, Wang, Zengyi, Zhuang, Hanyue, Zheng, Qian, Tang, Huajin, Gu, Shi, Du, Xin, Ma, De, Pan, Gang
Format: Preprint
Published: 2025
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author Zhu, Xiaolei
Jin, Xiaofei
Kang, Ziyang
Sun, Chonghui
Feng, Junjie
Hu, Dingwen
Wang, Zengyi
Zhuang, Hanyue
Zheng, Qian
Tang, Huajin
Gu, Shi
Du, Xin
Ma, De
Pan, Gang
author_facet Zhu, Xiaolei
Jin, Xiaofei
Kang, Ziyang
Sun, Chonghui
Feng, Junjie
Hu, Dingwen
Wang, Zengyi
Zhuang, Hanyue
Zheng, Qian
Tang, Huajin
Gu, Shi
Du, Xin
Ma, De
Pan, Gang
contents Neuromorphic computing promises brain-like efficiency, yet today's multi-chip systems scale over PCBs and incur orders-of-magnitude penalties in bandwidth, latency, and energy, undermining biological algorithms and system efficiency. We present DarwinWafer, a hyperscale system-on-wafer that replaces off-chip interconnects with wafer-scale, high-density integration of 64 Darwin3 chiplets on a 300 mm silicon interposer. A GALS NoC within each chiplet and an AER-based asynchronous wafer fabric with hierarchical time-step synchronization provide low-latency, coherent operation across the wafer. Each chiplet implements 2.35 M neurons and 0.1 B synapses, yielding 0.15 B neurons and 6.4 B synapses per wafer.At 333 MHz and 0.8 V, DarwinWafer consumes ~100 W and achieves 4.9 pJ/SOP, with 64 TSOPS peak throughput (0.64 TSOPS/W). Realization is enabled by a holistic chiplet-interposer co-design flow (including an in-house interposer-bump planner with early SI/PI and electro-thermal closure) and a warpage-tolerant assembly that fans out I/O via PCBlets and compliant pogo-pin connections, enabling robust, demountable wafer-to-board integration. Measurements confirm 10 mV supply droop and a uniform thermal profile (34-36 °C) under ~100 W. Application studies demonstrate whole-brain simulations: two zebrafish brains per chiplet with high connectivity fidelity (Spearman r = 0.896) and a mouse brain mapped across 32 chiplets (r = 0.645). To our knowledge, DarwinWafer represents a pioneering demonstration of wafer-scale neuromorphic computing, establishing a viable and scalable path toward large-scale, brain-like computation on silicon by replacing PCB-level interconnects with high-density, on-wafer integration.
format Preprint
id arxiv_https___arxiv_org_abs_2509_16213
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle DarwinWafer: A Wafer-Scale Neuromorphic Chip
Zhu, Xiaolei
Jin, Xiaofei
Kang, Ziyang
Sun, Chonghui
Feng, Junjie
Hu, Dingwen
Wang, Zengyi
Zhuang, Hanyue
Zheng, Qian
Tang, Huajin
Gu, Shi
Du, Xin
Ma, De
Pan, Gang
Emerging Technologies
Artificial Intelligence
Hardware Architecture
Neuromorphic computing promises brain-like efficiency, yet today's multi-chip systems scale over PCBs and incur orders-of-magnitude penalties in bandwidth, latency, and energy, undermining biological algorithms and system efficiency. We present DarwinWafer, a hyperscale system-on-wafer that replaces off-chip interconnects with wafer-scale, high-density integration of 64 Darwin3 chiplets on a 300 mm silicon interposer. A GALS NoC within each chiplet and an AER-based asynchronous wafer fabric with hierarchical time-step synchronization provide low-latency, coherent operation across the wafer. Each chiplet implements 2.35 M neurons and 0.1 B synapses, yielding 0.15 B neurons and 6.4 B synapses per wafer.At 333 MHz and 0.8 V, DarwinWafer consumes ~100 W and achieves 4.9 pJ/SOP, with 64 TSOPS peak throughput (0.64 TSOPS/W). Realization is enabled by a holistic chiplet-interposer co-design flow (including an in-house interposer-bump planner with early SI/PI and electro-thermal closure) and a warpage-tolerant assembly that fans out I/O via PCBlets and compliant pogo-pin connections, enabling robust, demountable wafer-to-board integration. Measurements confirm 10 mV supply droop and a uniform thermal profile (34-36 °C) under ~100 W. Application studies demonstrate whole-brain simulations: two zebrafish brains per chiplet with high connectivity fidelity (Spearman r = 0.896) and a mouse brain mapped across 32 chiplets (r = 0.645). To our knowledge, DarwinWafer represents a pioneering demonstration of wafer-scale neuromorphic computing, establishing a viable and scalable path toward large-scale, brain-like computation on silicon by replacing PCB-level interconnects with high-density, on-wafer integration.
title DarwinWafer: A Wafer-Scale Neuromorphic Chip
topic Emerging Technologies
Artificial Intelligence
Hardware Architecture
url https://arxiv.org/abs/2509.16213